Graphene Based Thermal Conducting Paste and a Standalone Embedded System for Measurement of Thermal Conductivity
Journal Title: International Journal for Research in Applied Science and Engineering Technology (IJRASET) - Year 2017, Vol 5, Issue 2
Abstract
Graphene is an allotrope of carbon which is arranged in a honey-comb lattice structure. It is the basic building block of all other carbon allotropes such as graphite, charcoal, carbon nanotubes and fullerenes. Graphene has many miraculous properties. It is hypothesized to be 100 times stronger than steel and it is the only 2-dimensional substance in the world. The thickness of one layer of Graphene is so negligible i.e. it is just one carbon atom thick and so its single layer is considered to be 2-D. It is nearly transparent and conducts heat and electricity efficiently. This paper is based on exploiting the following properties of graphene: Graphene is the best known thermal conductor. Graphene forms bonds with a huge number of materials at molecular level. Graphene exhibits a variety of properties under the influence of different constraints. Thermal grease (also called CPU grease, heat sink compound, heat sink paste, thermal compound, thermal gel, thermal interface material, thermal paste) is a kind of thermally conductive (but usually electrically insulating) compound, which is commonly used as an interface between heat sinks and heat sources (e.g., high power consuming semiconductor devices). The main purpose of thermal grease is to eliminate air gaps or spaces which turn the junction into a dielectric layer (which act as thermal insulator) from the interface area so as to maximize heat transfer. [1] This Thermal paste/grease we created is comprised of TE-Graphene and ZnO2 (Zinc Oxide) mixed with the base matrix Silicone Grease where ZnO2 is the binding agent. The extraordinary thermal conductivity of graphene makes this paste much more efficient than its counterparts which uses filler materials like diamond, silver, Boron Nitride etc. To measure the thermal conductivity of the aforementioned material, we have designed a standalone embedded system to measure its thermal conductivity. This system’s functionality is verified using the calculation and verification of the thermal conductivity of two standard materials viz. copper and aluminium.
Authors and Affiliations
Ankur Jyoti Borthakur, Pranab Sharma, Himangshu Pal
Keywords
Related Articles
- EP ID EP23173
- DOI http://doi.org/10.22214/ijraset.2017.2085
- Views 327
- Downloads 6
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